Kinetic model of stress evolution during coalescence and growth of polycrystalline thin films.

Mechanisms of intrinsic stress formation in thin film systems

The effect of the adatom surface diffusivity on the evolution of the microstructure and the intrinsic stress of thin metal films was investigated for the case of growth of polycrystalline Ag films on amorphous SiO2 (a-SiO2) and amorphous Ge (a-Ge) substrates, with high and low Ag adatom surface diffusivity, respectively. The surface diffusivity of the deposited Ag adatoms on the a-Ge substrate ...

Modeling of Residual Stresses in Thin Metal Films

Residual mechanical stresses introduced during deposition of thin films and coatings have a significant impact on the reliability of electronic devices and structural components. The mechanical stress in thin metal films consists of a thermal component and an intrinsic component due to the evolution of the metal microstructure during film growth. Controlling of the intrinsic stress component ha...

Intrinsic stress, island coalescence, and surface roughness during the growth of polycrystalline films

Microstructural evolution during film growth

Atomic-scale control and manipulation of the microstructure of polycrystalline thin films during kinetically limited low-temperature deposition, crucial for a broad range of industrial applications, has been a leading goal of materials science during the past decades. Here, we review the present understanding of film growth processes—nucleation, coalescence, competitive grain growth, and recrys...

Synthesis and Structural Studies of Nickel ‎Doped Cobalt Ferrite Thin Films

   The growth and structural study of Nickel doped Cobalt ferrite thin films on glass substrate using spray pyrolysis technique have been done. The structural studies confirmed the growth of polycrystalline film having cubic structure with Fd3m space group. The x ray density was found to increase with Ni concentration, where as the reduction, in crystalline size, was found in XRD m...